Обложка книги Integrated Circuit Failure Analysis

Integrated Circuit Failure Analysis

ISBN: 0-471-97401-3; 978-0-471-97401-7;
Издательство: John Wiley and Sons, Ltd
Страниц: 174
Формат: 155x235

Fault analysis of highly-integrated semiconductor circuits has become an indispensable discipline in the optimization of product quality. Integrated Circuit Failure Analysis describes state-of-the-art procedures for exposing suspected failure sites in semiconductor devices. The author adopts a hands-on problem-oriented approach, founded on many years of practical experience, complemented by the explanation of basic theoretical principles. Features include: Advanced methods in device preparation and technical procedures for package inspection and semiconductor reliability. Illustration of chip isolation and step-by-step delay ring of chips by wet chemical and modern plasma dry etching techniques. Particular analysis of bipolar and MOS circuits, although techniques are equally relevant to other semiconductors. Advice on the choice of suitable laboratory equipment. Numerous photographs and drawings providing guidance for checking results. Focusing on modern techniques, this practical...

См. также:

Похожие книги:

Beck: ?advances? In Management Education
Semiconductor Packaging
Advanced Plasma Technology